The Biden administration launched its massive effort to out-compete China in semiconductor manufacturing on Tuesday, offering $39 billion in funding incentives for companies seeking to build manufacturing plants in the US.
Authorized by the CHIPS and Science Act last year, the Commerce Department opened the application process for companies competing for a share of the funding. This first round prioritizes applicants seeking to build domestic chip manufacturing facilities that can ensure the billions in taxpayer money are protected and leveraged to advance US national security goals.
“When we have finished implementing CHIPS for America, we will be the premier destination in the world where new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale and packaged with the most advanced technologies,” Commerce Secretary Gina Raimondo said in a statement Tuesday.
The Commerce Department also explained how it will be evaluating applicants for the first time. Companies applying for more than $150 million in funding will be required to provide childcare for construction and factory workers, restrict stock buybacks, and share part of their profits with the government if they are more profitable than projected.
Companies building these factories are expected to use union workers. The Biden administration plans to open up additional funding rounds this spring and fall to boost investment in chip-making materials and research facilities. Major chip manufacturers, like GlobalFoundries and Intel, have already leveraged the industry’s excitement over the money to strike new commercial partnerships and build factories across the US.
In a statement on Tuesday, Al Thompson, Intel’s vice president of US government relations, welcomed the program’s launch, calling it “an important step for American semiconductors to be globally competitive.” Intel however, declined to comment on whether it planned to apply for the funding.
As part of the announcement, the Commerce Department laid out goals it expects to meet in the next 10 years by administering the money. Specifically, the department plans to create two new “large-scale clusters” of chip fabs that produce “leading-edge” memory chips as well as current-generation and mature-node chips.
